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Eurotech combines the key technologies of the DEEP-ER Booster – NVM, NAM, KNL, Extoll fabric –  in a single innovative architecture. The design of this architecture is guided by extreme energy efficiency and industry-leading density. Eurotech’s “total liquid cooled” design ensures that all compute elements and peripherals are liquid cooled, avoiding the need for any air circulation in the system.

The DEEP-ER Booster designed by Eurotech uses their Aurora architecture, with an 18-node chassis as the main building block. Each node hosts one Intel® Xeon Phi™ manycore CPU with 96 GByte of DDR4 RAM. From each node, two PCIe gen3 x16 links are routed to the peripheral devices through the chassis backplane.

In the DEEP-ER Booster, each node is connected to an Intel® SSD P3700 storage device and an EXTOLL TOURMALET NIC. A specially developed chassis controller manages the peripheral card power state independently of the node CPU, enabling the EXTOLL NICs to route packets while their nodes are switched off.

The system has been tested with inlet water temperatures up to 50˚ C. This enables highly efficient system operation using hot water cooling.

KNL Board DEEP-ER Booster
Solder side of the Booster node board, prominently showing the mounting plate for the KNL CPU
KNL Board DEEP-ER Booster Backplane
The innovative coldplate on top of the Booster node board ensures direct liquid cooling of all board components